
Specications Models 891.44 and 892.44 (Ex Version)
Power supply UB
for Non-Ex version DC 12 V < UB ≤ 30 V
for Ex version see the section ‚Ex protection‘!
Permissible residual ripple
% of span/10 V
≤ 0.1
Supply voltage eect % ss ≤ 10
Output signal 4 … 20 mA, 2-wire system
Permissible max. load R
A for Non-Ex versions, Model 891.44:
R
A ≤ (UB - 12 V) / 0.02 A with RA in Ω and UB in Volt
for Ex versions, Model 892.44:
R
A ≤ (UB - 14 V) / 0.02 A with RA in Ω and UB in Volt
Eect of load % of span ≤ 0.1
Output signal adjustment
Zero point, electrical A
djustment of zero point through brief bridging of terminals 5 and 6,
or using the „scale selection switch“ option, selectable via button
1)
Scale selection 4 scales selectable via BCD switch
Linearity % of span ≤ 1.0 (limit point calibration)
Permissible
ambient temperatures °C -40 … +80, -40 … +60 with oxygen
Compensated temp. range °C -40 … +80
Temperature coecients in
compensated temp. range
Mean TK of zero
% of span/10 K
≤ 0.3
Mean TK of span
% of span/10 K
≤ 0.3
Ex protection according to EC-Type Examination Certicate
BSV 08 ATEX E 018 X for Model 892.44
Ex certication EEx II 2G EEx ia IIC T6
Conformity specications
Power supply U
i DC 14 … 30 V
Short circuit rating I
i mA max. 100
Rating P
i W max. 1
Internal capacitance C
i nF 12
Internal inductance L
i mH negligible
Medium temperature °C -40 … +80, -40 … +60 with oxygen
Ambient temperature °C -40 … +60 (T6)
CE-Conformity interference emission and immunity per EN 61326
Wiring L-connector (screw terminals up to 2.5 mm²)
Wiring protection protected against reverse polarity and overvoltage
Ingress protection IP 65 per EN 60529 / IEC 529
Wiring details,
2-wire
11592011.04 06/2014 GB/D/F/I
GB
WIKA operating instructions dierential pressure gauge models 712.15.100, 732.15.100
11
8. Transmitter for level measurement
1) Only possible within 30 seconds of connecting the supply voltage
Earth, connected
to case 2)
U
B+/Sig+
Terminals 3, 4, 5 and 6: only for internal
application
0V/Sig-
2) This connection must not be used
for equipotential bonding. The
instrument must be incorporated in
the equipotential bonding via the
process connection.
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